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- Modified epoxy resin EpiFine
Modified epoxy resin EpiFine®
EpiFine is an epoxy resin based, blended and modified resin product, and is known as a thermosetting resin. This product is developed to maximize electric, mechanical, adhesiveness and chemical resistance properties.
We offer a wide range of EpiFine products in the forms such as LED encapsulations, One-component blended resins, UV curing adhesive or Two-component blended resins. As one of our strength, we can develop and propose the customized products as following the desired properties such as heat-resistant, UV-resistant, curing temperature (60 to 200 ℃) or hardness (rubber like to solid).
Customer market
Various electronics devices or components (Automotive parts, Optical communication devices, Semiconductors (LED), Display devices, Large-size motors, etc.)
Features and main applications
Two-component Epoxy resin (LED) |
Light resistance | ・High-brightness shell-shaped ・RGB SMD LED |
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Heat resistance | ||
Low stress | ||
Two-component Transparent hybrid resin (LED) |
High heat resistance | ・White SMD LED ・White COB LED |
UV resistance | ||
Water permeable resistance (high gas barrier property) | ||
Two-component Transparent Epoxy resin (casting/adhesive) |
Frame resistance | ・Automotive devices/components ・Motor ・Power sources |
Low heat expansion | ||
One-component Epoxy resin (sealing/adhesive) |
High heat resistance (suitable for sealing and adhesion for SMT components) |
・Relay ・Optical pickups ・HDD ・Pressure control valves |
Low gas (protections of electrical connections, adhesive for optical devices) |
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Ultraviolet curing resin 1) Epoxy UV curing resin 2) Dual curing by UV and heat |
Low shrinkage | Optical component |
High adhesiveness | ||
Dual cure | ||
Highly functional resin (sealing/adhesive) | Thermal conductivity adhesive | ・Automotive devices/components |
Elastic adhesive |
〒103-8410
11-2, Nihonbashi Honcho 4-chome, Chuo-ku, Tokyo, 103-8410
3rd Sales Division FPTeam
TEL:03-3663-0276
FAX:03-3661-0037
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